HDAS

• Robust technology designed for severe environments
• Exceed MIL-DTL-55302 requirements
• 12 sizes from 11 to 253 contacts on 3, 4 or 5 rows
• Board-to-wire configurations with crimped contacts

• Commercial and Military Aerospace
• Electronic systems
• C5ISR
• Spatial

• High density : 1.905mm [.075] staggered grid
• Compact mezzanine connection with 16 mm between boards
• 4,5A per signal contact
• DWV 750 Vrms at sea level
• 500 mating cycles
• From -65 to 150 °C operating temperature
• Plating : 1,27μ Au on socket, 1μ Au on pin
• RoHS versions available
• Meet NASA/ESA outgassing specs requirements

You can download all the information you need below.